data sheet acquired from harris semiconductor schs093c ? revised october 2003 the CD14538B is interchangeable with type mc14538 and is similar to and pin-compatible with the cd4098b* and cd4538b. it can replace the cd4538b which type is not recommended for new designs. the CD14538B types are supplied in 16-lead hermetic dual-in-line ceramic packages (f3a suffix), 16-lead dual-in-line plastic packages (e suffix), 16-lead small-outline packages (m, m96, mt, and nsr suffixes), and 16-lead thin shrink small-outline packages (pw and pwr suffixes). copyright ? 2003, texas instruments incorporated
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-9055701ea active cdip j 16 1 none call ti level-nc-nc-nc CD14538Be active pdip n 16 25 pb-free (rohs) cu nipdau level-nc-nc-nc CD14538Bf active cdip j 16 1 none call ti level-nc-nc-nc CD14538Bf3a active cdip j 16 1 none call ti level-nc-nc-nc CD14538Bm active soic d 16 40 pb-free (rohs) cu nipdau level-2-260c-1 year/ level-1-235c-unlim CD14538Bm96 active soic d 16 2500 pb-free (rohs) cu nipdau level-2-260c-1 year/ level-1-235c-unlim CD14538Bmt active soic d 16 250 pb-free (rohs) cu nipdau level-2-260c-1 year/ level-1-235c-unlim CD14538Bnsr active so ns 16 2000 pb-free (rohs) cu nipdau level-2-260c-1 year/ level-1-235c-unlim CD14538Bpw active tssop pw 16 90 pb-free (rohs) cu nipdau level-1-250c-unlim CD14538Bpwr active tssop pw 16 2000 pb-free (rohs) cu nipdau level-1-250c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - may not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. none: not yet available lead (pb-free). pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. green (rohs & no sb/br): ti defines "green" to mean "pb-free" and in addition, uses package materials that do not contain halogens, including bromine (br) or antimony (sb) above 0.1% of total product weight. (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedecindustry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 28-feb-2005 addendum-page 1
mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2005, texas instruments incorporated
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